The package consists of a plastic blister that
seems to be designed for exposure of the memory kit. Before open it we
liked it, after we didn't. We at ocaholic like to unbox and box memory
over and over again and this one once opened you can't close it anymore
as you have to cut the package to pull the modules out.
didn't like the package, we are in love with the design and
heatspreaders of this memory kit. The kit is heavy in hand, has very
well manufactured heatspreaders and most of all has a black PCB which
is very very important for high performance (kidding...). Also the
design is dual sidded, some manufacturers only print one side of the
module and the other side stay empty.
heatspreaders wasn't easy, once again ADATA used some very good quality
thermal glue pads to maintain the heatspreaders on the ICs. Though we
did know which memory chips have been used for this memory kit due to
the specs always like to have a look at them. Below you find a shot of
one Samsung D-series HCH9 memory chip that powers those ADATA
The SPD reading tells us more about the memory itself like the
capacity, the name of the manufacturer, the JEDEC profiles stored which
are in 5 accompanied with one XMP profile and the week of production.
No Part number, pity. Also the XMP profile is misreaded by both CPU-Z
and motherboard's BIOS:
This means that unfortunately when XMP loaded the BIOS will set timings to
10-13-13 instead of 10-12-12. So for best performance you will have to ajust
primary timings manually.
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