AMD releases Beema and Mullins APUs

Puma with optimized heat dissipation

So far we are about one month from Computex 2014 and hardware manufacturers are already gearing up for what might be the most important exhibition of the year regarding IT components. AMD has now launched seven new APUs which are based on Puma architecture, the Beema and Mullins APUs.

Concering their Puma Architecture, AMD is especially proud of the fact that they have increased efficiency once more. Compared to the predecessor, AMD says that the performance as well as the power consumption should be significantly better.

In case of their new design AMD has for instance been working on optimizing leakage, which in the end always leads to lower power consumption and higher headroom in terms of frequency scaling. AMD claims to have reduced leakage by a whopping 20 percent, which left them with the option of increasing clocks speed by up to 400 MHz. Even with that frequency boost they manage to get a lower thermal design power.

What appears to be even more impressive concerns the integrated graphics unit. Still based on AMDs recent Graphics Core Next architecture, the improvements regarding leakage lead to a power consumption that has been lowered by no less than 38 percent, according to AMD. If we keep in mind that AMD is still using 28 nanometer manufacturing process, this seems to be quite an achievement but on the other hand, AMD has to push the boundries of this technology like "MAD" in order to remain competitive.

Following a list of all new models:

ModelCoresCPU FreqL2 CacheGPUShaderGPU FreqDDR3SDP/TDP
A10 Micro-6700T41.2/2.2GHz2MBRadeon R6128500MHz1333MHz2.8/4.5W
A4 Micro-6400T41.0/1.6GHz2MBRadeon R3128350MHz1333MHz2.8/4.5W
E1 Micro-6200T21.0/1.4GHz1MBRadeon R2128300MHz1066MHz2.8/3.95W
         
A6-631042.0/2.4GHz2MBRadeon R4128800MHz1866MHz15W
A4-621041.8/-GHz2MBRadeon R3128600MHz1600MHz15W
E2-611041.50/-GHz2MBRadeon R2128500MHz1600MHz15W
E1-601021.35/-GHz1MBRadeon R2128350MHz1333MHz10W


In terms of availability these new APUs should start shipping next week built-in with upcoming notebooks from partners. This is quite an usual scenario for AMD these days, since also with the last generation of low-power APU the company introduced new chips in the same way.




Source: AMD

News by Luca Rocchi and Marc Büchel - German Translation by Paul Görnhardt - Italian Translation by Francesco Daghini


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